Renesas Introduces Four-Channel Master IC and Sensor Signal Conditioner for the Growing IO-Link Market

IO-Link Market Projected to Grow at Over 20 Percent Annually Through 2028

Renesas Introduces Four-Channel Master IC and Sensor Signal Conditioner for the Growing IO-Link Market

Media Contacts:
Americas
Don Parkman
Renesas Electronics Corporation
+ 1-408-887-4308
don.parkman.xh@renesas.com

Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced two semiconductor solutions for the rapidly growing IO-Link market: the CCE4511 four-channel IO-Link master IC and the ZSSC3286 - IO-Link ready, dual-channel resistive sensor signal conditioner IC.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241016156761/en/

IO-Link is a digital communication protocol that is used most widely in industrial automation applications. As a standardized technology, it enables seamless communication between sensors, actuators, and other devices in an automation system. IO-Link has become increasingly popular in recent years due to its ability to provide real-time data and diagnostics and its ease of use and compatibility with existing systems. It also regulates & reduces wiring, enhances data availability, and offers remote configuration and monitoring. Market research firm Infogence Global Research estimates IO-Link will grow at over 20 percent per year, reaching over USD 34B in 2028. As a leader in industrial automation solutions, Renesas is committed to providing customers with innovative IO-Link solutions.

CCE4511 Four-Channel IO-Link Master IC

Renesas’ new CCE4511 is the industry’s first four-channel master IC for the IO-Link protocol with 500mA driving current for each channel and provides numerous advantages over two-channel master devices. It saves energy, reduces PCB size and requires fewer external components than competitive offerings.

The CCE4511 offers a high-voltage interface along with overvoltage detection and over-current protection. To improve application performance, an integrated IO-Link Frame Handler is provided, which automates most of the lower layer communication tasks. This reduces the microcontroller (MCU) loads significantly, thus gaining more performance for other tasks, and/or allowing designers to use a less expensive MCU. The CCE4511 has an ambient operating temperature of up to 125º C for harsh industrial environments. It also supports detection of ready pulses from IO-Link devices, which is required to fulfill the newly defined IO-Link Safety System Extension.

ZSSC3286 IO-Link Ready, Dual-Channel Resistive Sensor Signal Conditioner IC

The ZSSC3286 is a dual path sensor signal conditioning IC (SSC) for highly accurate amplification, digitization, and sensor-specific correction of sensor signals. It supports IO-Link connectivity with an integrated IO-Link stack running the IO-Link Smart Sensor Profile for digital measuring and switching sensors. The device is suitable for bridge and half-bridge sensors, as well as external voltage-source elements. Digital compensation of the sensor offset, sensitivity, temperature drift, and non-linearity is accomplished via a 32-bit Arm-based math core running a correction algorithm with calibration coefficients stored in a non-volatile, reprogrammable memory. The programmable, integrated sensor front-end allows optimally applying various sensors for a broad range of applications.

ZSSC3286 is the first sensor signal conditioner with an integrated IO-Link compliant stack. Traditionally, an additional microcontroller has been used to run the stack. The ZSSC3286 obsoletes the MCU, saving board space and costs. It also offers two parallel ADCs with up to 24-bit resolution, a measurement scheduler for optimized performance, and advanced system diagnostic functions.

“Our large base of industrial customers has asked us for new solutions to take advantage of the IO-Link protocol,” said Leopold Beer, VP, Connectivity Sensor Division for Renesas. “These two new products both provide industry-leading performance and functionality for IO-Link applications, and we anticipate further offerings for this important market.”

Winning Combinations

Renesas has combined both the CCE4511 and the ZSSC3286 with other offerings from Renesas’ broad line of embedded processing, analog, power and connectivity solutions to create the IO-Link Sensor Winning Combination. Winning Combinations are technically vetted system architectures from mutually compatible devices that work together seamlessly to bring an optimized low-risk design for a faster time to market. Renesas offers more than 400 Winning Combinations with a wide range of products from the Renesas portfolio to enable customers to speed up the design process and bring their products to market more quickly. They can be found at renesas.com/win.

Availability

The CCE4511 is available today in an 8mm x 8mm 56-QFN package. The CCE4511-EVAL-V1 evaluation kit is also available from Renesas and authorized distributors. More information is available at www.renesas.com/CCE4511.

The ZSSC3286 is also now available packaged in a 5mm x 5mm 40-QFN. It is also available in Wafer-Level Chip-Scale Package (WLCSP) format from Renesas. The ZSSC3286EVK evaluation kit is also shipping now. More information is available at http://www.renesas.com/ZSSC3286.

About Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) empowers a safer, smarter and more sustainable future where technology helps make our lives easier. A leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, YouTube, and Instagram.

All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.

View source version on businesswire.com: https://www.businesswire.com/news/home/20241016156761/en/